packaging board

英 [ˈpækɪdʒɪŋ bɔːd] 美 [ˈpækɪdʒɪŋ bɔːrd]

网络  包装用纸板

化学



双语例句

  1. Packaging industry: printing rubber plate engraving, plastic plates, double plates, die cutter cutting board.
    包装行业:雕刻印刷橡胶板、塑料板、双层板、刀模切刀板等。
  2. At the later phase of the design work, both parties should continue the packaging work, such as photographs, presentation board and files, and also the follow-up on the site.
    外双方在合作设计后期,中、外双方共同负责与本方案设计有关的表现图制作、展示板及商务文件等的包装配合工作及制作现场的人员跟踪。
  3. They are applied mainly for the packaging temperature and humidity disposal experiment and the properties test of the corrugated board.
    主要用于运输包装件的温湿度处理实验,瓦楞纸板的各项性能实验。
  4. Our company specializes in producing PP, PS anti-static, conductive, PVC, green PET, PE, flocking and fold, folding boxes and blister packaging products hollow board turnover box.
    苏州市金澳威包装制品有限公司专业生产PP、PS防静电、导电、PVC、环保PET、PE、植绒及折边、折盒等吸塑包装制品及中空板周转箱。
  5. Study of Technological Parameter of Heat Pressed Cotton Stalk Chip for Substituting Wood Packaging Board
    棉杆碎料热压代木包装板材的工艺参数研究
  6. Suitable for hardware packaging, foot cushion, anti-skid board, etc.
    适用于五金包装盒,脚塑,止滑板等。
  7. Packaging method and design key of the board products
    平板显示产品缓冲包装方法及其设计要领
  8. This paper researches into the paper packaging such as folding paper box, corrugated board box. It brings forward the theory that the point, line, plane, solid, angle, etc. are the key structure elements for paper packaging forming from paperboard to solid packaging.
    通过对折叠纸盒、瓦楞纸箱等纸包装的研究,提出点、线、面、体、角等结构要素是纸包装由平面纸板成型为立体包装关键的观点。
  9. The effect of furnish condition on the physical properties of middle layer of liquid packaging board and multiply liquid packaging board made from handsheets were evaluated for two wood furnishes which were SCAN spruce CTMP and Birch kraft pulps at different freeness.
    本文阐述了使用SCAN云杉CTMP和桦木BKP配抄液体包装纸板(LPB)时,浆料的配比和游离度对液体包装纸板芯层和液体包装纸板原纸物理强度指标的影响。
  10. Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board ( PWB) that make such high-density packaging possible are making greatly progress.
    以CSP为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。
  11. Comparing Some Packaging Board Materials for Large Power LED
    比较几种大功率LED封装基板材料
  12. As a packaging technique, COB ( Chip on Board) structure is usually used in IC and MEMS. However, the thermomechanical coupling effect because of CTE mismatch of different materials in COB will greatly affect the reliability and performance of the devices.
    COB(chiponBoard)是微电子和MEMS中常用的封装工艺之一,但该封装结构中由于多层异质材料耦合引入的热失配将对器件的性能和可靠性产生重要影响。
  13. In the paper, the simplified equivalent model is established to calculate the equivalent thermal resistance of several board materials, and by comparing the calculation results, the even more suitable packaging board material is found out.
    本文采用简化的等效封装模型,对几种基板材料的等效热阻进行计算,用计算结果来进行比较,从而选择出更为合适的可用于封装大功率LED的基板材料。
  14. Distribution of Residual Stress in Packaging Assemblies of Chip on Board
    板上芯片固化后残余应力分布的有限元模拟
  15. Application Of Flakeboard With Directional Structure In Our Packaging Industry The Present Situation and Prospects of Oriented Strand Board in China
    定向结构刨花板走近中国包装工业我国定向结构刨花板的现状和发展前景
  16. The first level packaging and other components are assembled on the same board, which is called the second level packaging, or board level packaging;
    将一级封装和其它元器件一同组装到基板(PWB或其它基板)上的二级封装,又称板级封装;
  17. The packaging industry is 'pulling' the primed circuit board ( PCB) technology level in the direction of semiconductor requirements.
    封装工业正在推动着印制线路板技术水平朝着半导体要求的方向发展。
  18. Currently in the semiconductor packaging process, the die chip connect with Lead frame pin by the chip interconnect to achieve the one step package, and after Trim/ Form chip connect with the substrate ( PCB board) by the soldering process.
    目前在半导体封装制程中,裸芯片通过芯片互连方法将其焊区与封装外引脚连接起来完成一级封装,经切筋成型后通过焊接工艺与基板(PCB板)连接。
  19. Corrugated Board is a kind of widely-used and environmental-friendly cushioning packaging material. It is a kind of basic material to make corrugated box. Corrugated Board is a kind of coach board which is made by using adhesive to put board paper and corrugated paper together.
    瓦楞纸板是广泛使用的一种绿色缓冲包装材料,是制造各类瓦楞纸箱的基材,它是由箱板纸和波纹状的瓦楞芯纸经胶粘剂粘合而成的多层纸板。
  20. Honeycomb as a new environmentally friendly material, not only can effectively savings and reduce the use of timber resources, but also greatly reduce the use of packaging foam, honeycomb paper on the domestic market Board demand is also growing.
    蜂窝纸板作为一种新型环保材料,不仅可以有效的节约和降低木材资源的使用,而且还可以极大的减少包装泡沫的使用,目前国内市场对蜂窝纸板的需求量变得越来越大。
  21. Environmental protection packaging materials has attracted more and more social attention, as an important class of low carbon environmental protection packaging material, the paperboard, with the new feature, appeared in various functional of board.
    环保包装材料日益受到社会的重视,纸板作为重要的一类低碳环保包装材料,在使用过程中被赋予其新的特征,出现了各种功能性纸板。